Packaging is classified as one of back-end processes in the integrated circuits (ICs) manufacturing, highly capital-intensive and involves complex processes. Unlike the front-end...
Abstract In order to perform an on-chip test for characterizing both static and transmission parameters of embedded analog-to-digital converters (ADCs), this paper presents an osci...
Abstract--Advances in very large-scale integration technology make clock skew more susceptible to process variations. Notwithstanding efficient exact zero-skew algorithms, clock sk...
The nonuniform substrate thermal profile and process variations are two major concerns in the present-day ultradeep submicrometer designs. To correctly predict performance/ leakage...
In this paper, we present the parallelization of tabu search on a network of workstations using PVM. Two parallelization strategies are integrated: functional decomposition strate...
Ahmad A. Al-Yamani, Sadiq M. Sait, Habib Youssef, ...