The research presented in this paper aims to inform interface design for mobile guides by understanding and modelling the built environments in which the guide will be used. This ...
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
Gian Luca Loi, Banit Agrawal, Navin Srivastava, Sh...
Chip multiprocessors with multiple simpler cores are gaining popularity because they have the potential to drive future performance gains without exacerbating the problems of powe...
Hongtao Zhong, Steven A. Lieberman, Scott A. Mahlk...
Network-on-Chips (NoCs) outperform buses in terms of scalability, parallelism and system modularity and therefore are considered as the main interconnect infrastructure in future c...
Enterprises may have multiple database systems spread across the organization for redundancy or for serving different applications. In such systems, query workloads can be distrib...