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180
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NOCS
2010
IEEE
15 years 5 months ago
2010
IEEE
—Three-dimensional network-on-chip (3D NoC), the combination of NoC and die-stacking 3D IC technology, is motivated to achieve lower latency, lower power consumption, and higher ...
193
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TPDS
2010
15 years 5 months ago
2010
Abstract—A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, highspeed interface to increase the device den...
234
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BMCBI
2011
15 years 2 months ago
2011
Background: The increasing availability of molecular sequence data means that the accuracy of future phylogenetic studies is likely to by limited by systematic bias and taxon choi...
200
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TCOM
2010
15 years 2 months ago
2010
Abstract--This paper proposes spectral efficient relayassisted transmit diversity techniques, i.e., space-time and space-frequency block codes (STBC/SFBC), for single carrier frequ...
199
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TWC
2010
15 years 1 months ago
2010
Abstract--In this paper, we deal with the performance of nonorthogonal Amplify-and-Forward protocols over block-fading channels (BFNAF), where the source retransmits the same data ...