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192
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DATE
2008
IEEE
16 years 1 months ago
2008
IEEE
With technology advances, the number of cores integrated on a chip and their speed of operation is increasing. This, in turn is leading to a significant increase in chip temperat...
182
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ICPP
2008
IEEE
16 years 1 months ago
2008
IEEE
A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, high-speed interface to increase the device density and ...
176
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ISQED
2008
IEEE
16 years 1 months ago
2008
IEEE
Negative bias temperature instability (NBTI) is one of the primary limiters of reliability lifetime in nano-scale integrated circuits. NBTI manifests itself in a gradual increase ...
192
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ISVLSI
2008
IEEE
16 years 1 months ago
2008
IEEE
In high-performance VLSI circuits, the on-chip power densities are playing dominant role due to increased scaling of technology, increasing number of components, frequency and ban...
162
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KBSE
2008
IEEE
16 years 1 months ago
2008
IEEE
Software systems increasingly integrate Off-The-Shelf (OTS) components. However, due to the lack of knowledge about the reused OTS components, this integration is fragile and can ...