4359 search results - page 378 / 872 » Automated Pipeline Design |
172
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DAC
2007
ACM
16 years 7 months ago
2007
ACM
Due to shrinking technology, increasing functional frequency and density, and reduced noise margins with supply voltage scaling, the sensitivity of designs to supply voltage noise...
174
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DAC
2007
ACM
16 years 7 months ago
2007
ACM
The flip-chip package provides a high chip-density solution to the demand for more I/O pads of VLSI designs. In this paper, we present the first routing algorithm in the literatur...
163
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DAC
2007
ACM
16 years 7 months ago
2007
ACM
In this paper, we present a new multi-packing tree (MP-tree) representation for macro placement to handle mixed-size designs. Based on binary trees, the MP-tree is very efficient,...
164
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DAC
2007
ACM
16 years 7 months ago
2007
ACM
With increasing time-to-market pressure and shortening semiconductor product cycles, more and more chips are being designed with library-based methodologies. In spite of this shif...
181
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DAC
2007
ACM
16 years 7 months ago
2007
ACM
Interrupt behaviors, especially the external ones, are difficult to verify in a microprocessor design project in that they involve both interacting hardware and software. This pap...