Through-silicon via (TSV) fabrication causes tensile stress around TSVs which results in significant carrier mobility variation in the devices in their neighborhood. Keep-out zone ...
The ability to fly at low altitude while actively avoiding collisions with the terrain and other objects is a great challenge for small unmanned aircraft. This paper builds on top ...
Jean-Christophe Zufferey, Antoine Beyeler, Dario F...
Abstract. VoIP has become a major application of multimedia communications over IP. Many initiatives around the world focus on the detection of attacks against VoIP services and in...
Abstract--Many efforts are centered around creating largescale networks of "smart things" found in the physical world (e.g., wireless sensor and actuator networks, embedd...
Abstract. The complexity of today's embedded systems and their development trajectories requires a systematic, model-driven design approach, supported by tooling wherever poss...
Twan Basten, Emiel van Benthum, Marc Geilen, Marti...