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ICCAD
2010
IEEE
216views Hardware» more  ICCAD 2010»
15 years 4 months ago
Stress-driven 3D-IC placement with TSV keep-out zone and regularity study
Through-silicon via (TSV) fabrication causes tensile stress around TSVs which results in significant carrier mobility variation in the devices in their neighborhood. Keep-out zone ...
Krit Athikulwongse, Ashutosh Chakraborty, Jae-Seok...
ICRA
2010
IEEE
185views Robotics» more  ICRA 2010»
15 years 4 months ago
Autonomous flight at low altitude with vision-based collision avoidance and GPS-based path following
The ability to fly at low altitude while actively avoiding collisions with the terrain and other objects is a great challenge for small unmanned aircraft. This paper builds on top ...
Jean-Christophe Zufferey, Antoine Beyeler, Dario F...
IFIP
2010
Springer
15 years 4 months ago
Labeled VoIP Data-Set for Intrusion Detection Evaluation
Abstract. VoIP has become a major application of multimedia communications over IP. Many initiatives around the world focus on the detection of attacks against VoIP services and in...
Mohamed Nassar, Radu State, Olivier Festor
IOT
2010
15 years 4 months ago
A resource oriented architecture for the Web of Things
Abstract--Many efforts are centered around creating largescale networks of "smart things" found in the physical world (e.g., wireless sensor and actuator networks, embedd...
Dominique Guinard, Vlad Trifa, Erik Wilde
ISOLA
2010
Springer
15 years 4 months ago
Model-Driven Design-Space Exploration for Embedded Systems: The Octopus Toolset
Abstract. The complexity of today's embedded systems and their development trajectories requires a systematic, model-driven design approach, supported by tooling wherever poss...
Twan Basten, Emiel van Benthum, Marc Geilen, Marti...