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Architecture and evaluation of an unplanned 802.11b mesh net...
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ICPP
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Tightly-Coupled Multi-Layer Topologies for 3-D NoCs
16 years 11 days ago
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Three-dimensional Network-on-Chip (3-D NoC) is an emerging research topic exploring the network architecture of 3-D ICs that stack several smaller wafers for reducing wire length ...
Hiroki Matsutani, Michihiro Koibuchi, Hideharu Ama...
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