This paper provides a case study that shows how a demanding application stresses the capabilities of today's CAD tools, especially in the integration of products from multipl...
Stephen Dean Brown, Naraig Manjikian, Zvonko G. Vr...
As high-level models in C and SystemC are increasingly used for veriļ¬cation and even design (through high-level synthesis) of electronic systems, there is a growing need for com...
A new modeling framework is introduced for the analytical study of medium access control (MAC) protocols operating in multihop ad hoc networks. The model takes into account the eļ...
Marcelo M. Carvalho, Jose Joaquin Garcia-Luna-Acev...
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV ļ¬ll material and s...
Main stream operating system kernels lack a strong and reliable mechanism for identifying the running processes and binding them to the corresponding executable applications. In t...
Hussain M. J. Almohri, Danfeng (Daphne) Yao, Denni...