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ICCD
2005
IEEE
221views Hardware» more  ICCD 2005»
16 years 3 months ago
Broadband Impedance Matching for Inductive Interconnect in VLSI Packages
Abstract— Noise induced by impedance discontinuities from VLSI packaging is one of the leading challenges facing system level designers in the next decade. The performance of IC ...
Brock J. LaMeres, Sunil P. Khatri
ICCD
2003
IEEE
123views Hardware» more  ICCD 2003»
16 years 3 months ago
Simplifying SoC design with the Customizable Control Processor Platform
With the circuit density available in today’s ASIC design systems, increased integration is possible creating more complexity in the design of a System on a Chip (SoC). IBM’s ...
C. Ross Ogilvie, Richard Ray, Robert Devins, Mark ...
SOSP
2001
ACM
16 years 3 months ago
Resilient Overlay Networks
A Resilient Overlay Network (RON) is an architecture that allows distributed Internet applications to detect and recover from path outages and periods of degraded performance with...
David G. Andersen, Hari Balakrishnan, M. Frans Kaa...
PEPM
2009
ACM
16 years 3 months ago
Bidirectional data-flow analyses, type-systematically
We show that a wide class of bidirectional data-flow analyses and program optimizations based on them admit declarative descriptions in the form of type systems. The salient feat...
Maria João Frade, Ando Saabas, Tarmo Uustal...
WWW
2010
ACM
16 years 1 months ago
Earthquake shakes Twitter users: real-time event detection by social sensors
Twitter, a popular microblogging service, has received much attention recently. An important characteristic of Twitter is its real-time nature. For example, when an earthquake occ...
Takeshi Sakaki, Makoto Okazaki, Yutaka Matsuo
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