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IPPS
2000
IEEE
15 years 11 months ago
Optoelectronic Multi-chip Modules Based on Imaging Fiber Bundle Structures
In this paper, we present a new packaging architecture for chip-level optical interconnections based on imaging fiber bundles. Imaging fiber bundles consist of densely packed arra...
Donald M. Chiarulli, Steven P. Levitan
GROUP
1999
ACM
15 years 10 months ago
Supporting the shared care of diabetic patients
This paper reports on a study of clinicians who care for diabetic patients, and on the design of an application to support their work. The clinicians' long-term activity is r...
Tim Kindberg, Nick Bryan-Kinns, Ranjit Makwana
RE
1999
Springer
15 years 10 months ago
Aspect-Oriented Requirements Engineering for Component-Based Software Systems
Developing requirements for software components, and ensuring these requirements are met by component designs, is very challenging, as very often application domain and stakeholde...
John C. Grundy
HPCA
1996
IEEE
15 years 10 months ago
Co-Scheduling Hardware and Software Pipelines
Exploiting instruction-level parallelism (ILP) is extremely important for achieving high performance in application specific instruction set processors (ASIPs) and embedded process...
Ramaswamy Govindarajan, Erik R. Altman, Guang R. G...
ATAL
2006
Springer
15 years 10 months ago
A comparison between mechanisms for sequential compute resource auctions
This paper describes simulations designed to test the relative efficiency of two different sequential auction mechanisms for allocating compute resources between users in a shared...
Andrew Byde