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152
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DATE
2009
IEEE
16 years 1 months ago
2009
IEEE
Abstract—This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked silicon integrated circuits (ICs). The 3D power distribution network is modele...
173
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GLVLSI
2009
IEEE
16 years 1 months ago
2009
IEEE
Recently, cooperative communication has attracted a lot of attention for its potential to increase spatial diversity. However, limited attention has been paid to the physical laye...
151
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ICASSP
2009
IEEE
16 years 1 months ago
2009
IEEE
In this paper, we propose a novel nonparametric modeling technique, namely Space Kernel Analysis (SKA), as a result of the definition of the space kernel. We analyze the uncertai...
152
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NCA
2009
IEEE
16 years 1 months ago
2009
IEEE
—It has been observed in recent years that in many applications service time demands are highly variable. Without foreknowledge of exact service times of individual jobs, process...
215
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NOCS
2009
IEEE
16 years 1 months ago
2009
IEEE
While NoCs are efficient in delivering high throughput point-to-point traffic, their multi-hop operation is too slow for latency sensitive signals. In addition, NoCS are inefficie...