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ACSD
2010
IEEE
224views Hardware» more  ACSD 2010»
15 years 4 months ago
Robustness of Sequential Circuits
Digital components play a central role in the design of complex embedded systems. These components are interconnected with other, possibly analog, devices and the physical environm...
Laurent Doyen, Thomas A. Henzinger, Axel Legay, De...
TPDS
1998
129views more  TPDS 1998»
15 years 6 months ago
The Offset Cube: A Three-Dimensional Multicomputer Network Topology Using Through-Wafer Optics
—Three-dimensional packaging technologies are critical for enabling ultra-compact, massively parallel processors (MPPs) for embedded applications. Through-wafer optical interconn...
W. Stephen Lacy, José Cruz-Rivera, D. Scott...
CODES
2005
IEEE
15 years 12 months ago
Memory access optimizations in instruction-set simulators
Design of programmable processors and embedded applications requires instruction-set simulators for early exploration and validation of candidate architectures. Interpretive simul...
Mehrdad Reshadi, Prabhat Mishra
VLSID
2007
IEEE
131views VLSI» more  VLSID 2007»
16 years 6 months ago
Defect-Aware Synthesis of Droplet-Based Microfluidic Biochips
Recent advances in microfluidics technology have led to the emergence of miniaturized biochip devices for biochemical analysis. A promising category of microfluidic biochips relie...
Tao Xu, Krishnendu Chakrabarty, Fei Su
DAC
2007
ACM
16 years 7 months ago
Computationally Efficient Power Integrity Simulation for System-on-Package Applications
Power integrity simulation for system-on-package (SoP) based modules is a crucial bottleneck in the SoP design flow. In this paper, the multi-layer finite difference method (M-FDM...
Krishna Bharath, Ege Engin, Madhavan Swaminathan, ...