—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Mo...
Simulation is perhaps the most cost-effective tool to evaluate the operation of a system under design. A flexible, easy to extend, fully object-oriented, and multilayered simulato...
Abbas Nayebi, Sina Meraji, Arash Shamaei, Hamid Sa...
The feature interaction problem is prominent in telephone service development. Through a number of case studies, we have discovered that no single semantic framework is suitable f...
J. Paul Gibson, Geoff Hamilton, Dominique Mé...
: In a collaborative computer-supported engineering environment, the interoperation of various applications will need a representation that goes beyond the current geometry-based r...
Christel Dartigues, Parisa Ghodous, Michael Grunin...
In recent years researchers have developed a wide range of powerful automated reasoning systems. We have leveraged these systems to build Jahob, a program specification, analysis, ...