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ASPDAC
2012
ACM
238views Hardware» more  ASPDAC 2012»
14 years 2 months ago
Design for manufacturability and reliability for TSV-based 3D ICs
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Mo...
ASIAMS
2007
IEEE
16 years 21 days ago
XMulator: A Listener-Based Integrated Simulation Platform for Interconnection Networks
Simulation is perhaps the most cost-effective tool to evaluate the operation of a system under design. A flexible, easy to extend, fully object-oriented, and multilayered simulato...
Abbas Nayebi, Sina Meraji, Arash Shamaei, Hamid Sa...
IFM
1999
Springer
15 years 10 months ago
Integration Problems in Telephone Feature Requirements
The feature interaction problem is prominent in telephone service development. Through a number of case studies, we have discovered that no single semantic framework is suitable f...
J. Paul Gibson, Geoff Hamilton, Dominique Mé...
CERA
2007
105views more  CERA 2007»
15 years 6 months ago
CAD/CAPP Integration using Feature Ontology
: In a collaborative computer-supported engineering environment, the interoperation of various applications will need a representation that goes beyond the current geometry-based r...
Christel Dartigues, Parisa Ghodous, Michael Grunin...
CADE
2009
Springer
16 years 7 months ago
Integrated Reasoning and Proof Choice Point Selection in the Jahob System - Mechanisms for Program Survival
In recent years researchers have developed a wide range of powerful automated reasoning systems. We have leveraged these systems to build Jahob, a program specification, analysis, ...
Martin C. Rinard