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TCAD
2008
114views more  TCAD 2008»
15 years 6 months ago
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
CVPR
2009
IEEE
17 years 1 months ago
Monitoring, Recognizing and Discovering Social Networks
This work addresses the important problem of the discovery and analysis of social networks from surveillance video. A computer vision approach to this problem is made possible b...
Ting Yu, Ser Nam Lim, Kedar A. Patwardhan, Nils Kr...
ICIP
2005
IEEE
16 years 7 months ago
Pedestrian classification from moving platforms using cyclic motion pattern
This paper describes an efficient pedestrian detection system for videos acquired from moving platforms. Given a detected and tracked object as a sequence of images within a bound...
Yang Ran, Qinfen Zheng, Isaac Weiss, Larry S. Davi...
DAC
2005
ACM
16 years 7 months ago
Segregation by primary phase factors: a full-wave algorithm for model order reduction
Existing Full-wave Model Order Reduction (FMOR) approaches are based on Expanded Taylor Series Approximations (ETAS) of the oscillatory full-wave system matrix. The accuracy of su...
Thomas J. Klemas, Luca Daniel, Jacob K. White
DAC
2006
ACM
16 years 7 months ago
Systematic temperature sensor allocation and placement for microprocessors
Modern high performance processors employ advanced techniques for thermal management, which rely on accurate readings of on-die thermal sensors. As the importance of thermal effec...
Rajarshi Mukherjee, Seda Ogrenci Memik