Recently, overlay network-based collaborative applications such as instant messaging, content sharing, and Internet telephony are becoming increasingly popular. Many of these appli...
Osama Al-Haj Hassan, Lakshmish Ramaswamy, John A. ...
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Several recent papers have proposed or analyzed optimal algorithms to route all-to-all personalizedcommunication (AAPC) over communication networks such as meshes, hypercubes and ...
Software Product-lines (SPLs) use modular software components that can be reconfigured into different variants for different requirements sets. Feature modeling is a common method...
This paper is concerned with studying how the minimum power loss in a power system is related to its network topology. The existing algorithms in the literature all exploit nonline...