Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
— This paper introduces the Abstract Data and Communication Library (ADCL). ADCL is an application level communication library aiming at providing the highest possible performanc...
: The Cell is a heterogeneous multi-core processor, which has eight co-processors, called SPEs. The SPEs can access a common shared main memory through DMA, and each SPE can direct...
M. K. Velamati, Arun Kumar, Naresh Jayam, Ganapath...
The increasing popularity of high-volume performancecritical Internet applications calls for a scalable server design that allows meeting individual response-time guarantees. Cons...
Service overlay networks have recently attracted tremendous interests. In this paper, we propose a new integrated framework for specifying services composed of service components ...