This paper studies TSV-to-TSV coupling in 3D ICs. A full-chip SI analysis flow is proposed based on the proposed coupling model. Analysis results show that TSVs cause significan...
Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, ...
We address the problem of segmentation and recognition of sequences of multimodal human interactions in meetings. These interactions can be seen as a rough structure of a meeting, ...
Marc Al-Hames, Alfred Dielmann, Daniel Gatica-Pere...
In this paper Hidden Markov Model algorithms are considered as a method for computing conditional properties of continuous-time stochastic simulation models. The goal is to develo...
Fabian Wickborn, Claudia Isensee, Thomas Simon, Sa...
The development of high-resolution microscopy makes possible the high-throughput screening of cellular information, such as gene expression at single cell resolution. One of the cr...
Fuhui Long, Hanchuan Peng, Xiao Liu, Stuart K. Kim...
Traditional corner analysis fails to guarantee a target yield for a given performance metric. However, recently proposed solutions, in the form of statistical timing analysis, whi...