Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
Pingqiang Zhou, Yuchun Ma, Zhuoyuan Li, Robert P. ...
Todays, we assist to the explosive development of mobile computing devices like PDAs and cell-phones, the integration of embedded intelligence (like Web server) in more and more c...
The advent of affordable, shared-nothing computing systems portends a new class of parallel database management systems (DBMS) for on-line transaction processing (OLTP) applicatio...
This paper introduces a new approach to provide users with solutions to explore a domain via an information space. A key point in our approach is that information searching and ex...
Model Driven Data Integration is a data integration approach that proactively incorporates and utilizes metadata across the data integration process. By decoupling data and metada...
Hyeonsook Kim, Ying Zhang, Samia Oussena, Tony Cla...