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151
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ICCAD
2006
IEEE
16 years 3 months ago
2006
IEEE
Increasing power densities in Field Programmable Gate Arrays (FPGAs) have made them susceptible to thermal problems. The advent of platform FPGAs has further exacerbated the probl...
164
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ICCAD
2006
IEEE
16 years 3 months ago
2006
IEEE
Although many recent advances have been made in hardware synthesis techniques from software programming languages such as C, the performance of synthesized hardware commonly suffe...
178
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ICCAD
2005
IEEE
16 years 3 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
144
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ICCAD
2005
IEEE
16 years 3 months ago
2005
IEEE
The increasing variability of process parameters leads to substantial parametric yield losses due to timing and leakage power constraints. Leakage power is especially affected by ...
211
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ICCAD
2003
IEEE
16 years 3 months ago
2003
IEEE
Transient Signal Analysis (TSA) is a parametric device testing technique based on the analysis of dynamic (transient) current (iDDT) drawn by the core logic from the power supply ...