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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
16 years 3 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
CP
2009
Springer
16 years 7 months ago
Constraints of Difference and Equality: A Complete Taxonomic Characterisation
Abstract. Many combinatorial problems encountered in practice involve constraints that require that a set of variables take distinct or equal values. The AllDifferent constraint, i...
Emmanuel Hebrard, Dániel Marx, Barry O'Sull...
SARA
2009
Springer
16 years 1 months ago
Common Subexpressions in Constraint Models of Planning Problems
Constraint Programming is an attractive approach for solving AI planning problems by modelling them as Constraint Satisfaction Problems (CSPs). However, formulating effective cons...
Andrea Rendl, Ian Miguel, Ian P. Gent, Peter Grego...
ISORC
1998
IEEE
15 years 11 months ago
Specification of Real-Time Interaction Constraints
We present a coordination language and its semantics for specification and implementation of object-oriented realtime systems. Real-time systems operate under real-time constraint...
Brian Nielsen, Shangping Ren, Gul Agha
TSP
2010
15 years 1 months ago
MIMO transceiver optimization with linear constraints on transmitted signal covariance components
Abstract--This correspondence revisits the joint transceiver optimization problem for multiple-input multiple-output (MIMO) channels. The linear transceiver as well as the transcei...
Ching-Chih Weng, P. P. Vaidyanathan