— In three-dimensional (3D) chips, the amount of supply current per package pin is significantly more than in two-dimensional (2D) designs. Therefore, the power supply noise pro...
Pingqiang Zhou, Karthikk Sridharan, Sachin S. Sapa...
Parallel and distributed systems are representative of large and complex systems that require the application of formal methods. These systems are often unreliable because implemen...
Victoria Chernyakhovsky, Peter Frey, Radharamanan ...
Particle-based simulations are a popular tool for researchers in various sciences. In combination with the availability of ever larger COTS clusters and the consequently increasin...
Achieving the dimensional integrity for a complex structural assembly is a demanding task due to the manufacturing variations of parts and the tolerance relationship between them....
We tackle the previously unaddressed problem of unsupervised determination of the optimal morphological segmentation for statistical machine translation (SMT) and propose a segmen...