Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
In this paper, a comprehensive and fast method is presented for the timing analysis of process variations on single-walled carbon nanotube (SWCNT) bundles. Unlike previous works t...
Double patterning lithography seems to be a prominent choice for 32nm and 22nm technologies. Double patterning lithography techniques require additional masks for a single interco...
Kwangok Jeong, Andrew B. Kahng, Rasit Onur Topalog...
WIMAX (Worldwide Interoperability for Microwave Access) is a promising new networking technology that potentially offers high speed and wide area wireless access services that com...
An experimental study shows the feasibility of service-oriented architectures for industrial automation and control systems even with respect to lower, real-time dependent control...
Andre Pohl, Heiko Krumm, Felix Holland, Franz-Jose...