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SLIP
2009
ACM
16 years 1 months ago
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
168
Voted
SLIP
2009
ACM
16 years 1 months ago
Closed-form solution for timing analysis of process variations on SWCNT interconnect
In this paper, a comprehensive and fast method is presented for the timing analysis of process variations on single-walled carbon nanotube (SWCNT) bundles. Unlike previous works t...
Peng Sun, Rong Luo
SLIP
2009
ACM
16 years 1 months ago
Is overlay error more important than interconnect variations in double patterning?
Double patterning lithography seems to be a prominent choice for 32nm and 22nm technologies. Double patterning lithography techniques require additional masks for a single interco...
Kwangok Jeong, Andrew B. Kahng, Rasit Onur Topalog...
WOWMOM
2009
ACM
146views Multimedia» more  WOWMOM 2009»
16 years 1 months ago
Optimization of WiMax modulation scheme with a cross layer erasure code
WIMAX (Worldwide Interoperability for Microwave Access) is a promising new networking technology that potentially offers high speed and wide area wireless access services that com...
Lei Zhang, Patrick Sénac, Roksana Boreli, M...
196
Voted
AINA
2008
IEEE
16 years 1 months ago
Service-Orientation and Flexible Service Binding in Distributed Automation and Control Systems
An experimental study shows the feasibility of service-oriented architectures for industrial automation and control systems even with respect to lower, real-time dependent control...
Andre Pohl, Heiko Krumm, Felix Holland, Franz-Jose...
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