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190
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ICCAD
2006
IEEE
16 years 3 months ago
2006
IEEE
Abstract— Design variability due to within-die and die-todie process variations has the potential to significantly reduce the maximum operating frequency and the effective yield...
191
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3DIC
2009
IEEE
16 years 1 months ago
2009
IEEE
Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
191
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AINA
2009
IEEE
16 years 1 months ago
2009
IEEE
Abstract — Governing business compliance with regulations, laws, best practices, contracts, and the like is not an easy task, and so far there are only limited software products ...
156
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DATE
2009
IEEE
16 years 1 months ago
2009
IEEE
Abstract—This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked silicon integrated circuits (ICs). The 3D power distribution network is modele...
157
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WETICE
2009
IEEE
16 years 1 months ago
2009
IEEE
Abstract—BitTorrent is a highly popular peer-to-peer filesharing protocol. Much BitTorrent activity takes place within private virtual communities called “Private Trackers” ...