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147
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COR
2008
15 years 6 months ago
2008
Introducing a new concept of (, )-fairness, which allows for a bounded fairness compromise, so that a source is allocated a rate neither less than 0 1, nor more than 1, times...
154
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CORR
2008
Springer
15 years 6 months ago
2008
Springer
: Agent-based modelling and simulation offers a new and exciting way of understanding the world of work. In this paper we describe the development of an agent-based simulation mode...
146
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CORR
2010
Springer
15 years 6 months ago
2010
Springer
This paper examines the relationship between gestures' function and form in design collaboration. It adopts a cognitive design research viewpoint. The analysis is restricted t...
170
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CORR
2008
Springer
15 years 6 months ago
2008
Springer
We describe a new approach to fit the polyhedron describing a 3D building model to the point cloud of a Digital Elevation Model (DEM). We introduce a new kinetic framework that hi...
127
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CORR
2008
Springer
15 years 6 months ago
2008
Springer
Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch Through-Silicon Via (TSV) for advanced interconnections. The ...