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DAC
2006
ACM
16 years 7 months ago
A thermally-aware performance analysis of vertically integrated (3-D) processor-memory hierarchy
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
Gian Luca Loi, Banit Agrawal, Navin Srivastava, Sh...
WWW
2004
ACM
16 years 7 months ago
Personalization in distributed e-learning environments
Personalized support for learners becomes even more important, when e-Learning takes place in open and dynamic learning and information networks. This paper shows how to realize p...
Peter Dolog, Nicola Henze, Wolfgang Nejdl, Michael...
VLSID
2006
IEEE
142views VLSI» more  VLSID 2006»
16 years 7 months ago
Impact of Configurability and Extensibility on IPSec Protocol Execution on Embedded Processors
- Security protocols, such as IPSec and SSL, are being increasingly deployed in the context of networked embedded systems. The resource-constrained nature of embedded systems and, ...
Nachiketh R. Potlapally, Srivaths Ravi, Anand Ragh...
SIGCOMM
2009
ACM
16 years 1 months ago
MobiClique: middleware for mobile social networking
We consider a mobile ad hoc network setting where Bluetooth enabled mobile devices communicate directly with other devices as they meet opportunistically. We design and implement ...
Anna Kaisa Pietiläinen, Earl Oliver, Jason Le...
PLDI
2005
ACM
16 years 4 days ago
Programming ad-hoc networks of mobile and resource-constrained devices
Ad-hoc networks of mobile devices such as smart phones and PDAs represent a new and exciting distributed system architecture. Building distributed applications on such an architec...
Yang Ni, Ulrich Kremer, Adrian Stere, Liviu Iftode
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