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ICPP
2007
IEEE
16 years 27 days ago
Tightly-Coupled Multi-Layer Topologies for 3-D NoCs
Three-dimensional Network-on-Chip (3-D NoC) is an emerging research topic exploring the network architecture of 3-D ICs that stack several smaller wafers for reducing wire length ...
Hiroki Matsutani, Michihiro Koibuchi, Hideharu Ama...
ICPP
2006
IEEE
16 years 19 days ago
Data Sharing Pattern Aware Scheduling on Grids
These days an increasing number of applications, especially in science and engineering, are dealing with a massive amount of data; hence they are dataintensive. Bioinformatics, da...
Young Choon Lee, Albert Y. Zomaya
IPPS
2006
IEEE
16 years 18 days ago
Honeybees: combining replication and evasion for mitigating base-station jamming in sensor networks
By violating MAC-layer protocols, the jamming attack aims at blocking successful communication among wireless nodes. Wireless sensor networks (WSNs) are highly vulnerable to jammi...
Sherif M. Khattab, Daniel Mossé, Rami G. Me...
IPPS
2006
IEEE
16 years 18 days ago
On the impact of data input sets on statistical compiler tuning
In recent years, several approaches have been proposed to use profile information in compiler optimization. This profile information can be used at the source level to guide loo...
Masayo Haneda, Peter M. W. Knijnenburg, Harry A. G...
IPPS
2006
IEEE
16 years 18 days ago
A simulation study of the effects of multi-path approaches in e-commerce applications
Response time is a key factor of any e-Commerce application, and a set of solutions have been proposed to provide low response time despite network congestions or failures. Being ...
Paolo Romano, Francesco Quaglia, Bruno Ciciani