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MICRO
2006
IEEE
144views Hardware» more  MICRO 2006»
16 years 20 days ago
Die Stacking (3D) Microarchitecture
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
Bryan Black, Murali Annavaram, Ned Brekelbaum, Joh...
MOBICOM
2005
ACM
16 years 7 days ago
Self-management in chaotic wireless deployments
Over the past few years, wireless networking technologies have made vast forays into our daily lives. Today, one can find 802.11 hardware and other personal wireless technology e...
Aditya Akella, Glenn Judd, Srinivasan Seshan, Pete...
MOBICOM
2005
ACM
16 years 7 days ago
GrooveSim: a topography-accurate simulator for geographic routing in vehicular networks
Vehicles equipped with wireless communication devices are poised to deliver vital services in the form of safety alerts, traffic congestion probing and on-road commercial applicat...
Rahul Mangharam, Daniel S. Weller, Daniel D. Stanc...
206
Voted
CF
2007
ACM
15 years 10 months ago
An analysis of the effects of miss clustering on the cost of a cache miss
In this paper we describe a new technique, called pipeline spectroscopy, and use it to measure the cost of each cache miss. The cost of a miss is displayed (graphed) as a histogra...
Thomas R. Puzak, Allan Hartstein, Philip G. Emma, ...
BMCBI
2010
133views more  BMCBI 2010»
15 years 6 months ago
Integrated prediction of one-dimensional structural features and their relationships with conformational flexibility in helical
Background: Many structural properties such as solvent accessibility, dihedral angles and helix-helix contacts can be assigned to each residue in a membrane protein. Independent s...
Shandar Ahmad, Yumlembam Hemjit Singh, Yogesh Paud...