3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
Bryan Black, Murali Annavaram, Ned Brekelbaum, Joh...
Over the past few years, wireless networking technologies have made vast forays into our daily lives. Today, one can find 802.11 hardware and other personal wireless technology e...
Vehicles equipped with wireless communication devices are poised to deliver vital services in the form of safety alerts, traffic congestion probing and on-road commercial applicat...
Rahul Mangharam, Daniel S. Weller, Daniel D. Stanc...
In this paper we describe a new technique, called pipeline spectroscopy, and use it to measure the cost of each cache miss. The cost of a miss is displayed (graphed) as a histogra...
Thomas R. Puzak, Allan Hartstein, Philip G. Emma, ...
Background: Many structural properties such as solvent accessibility, dihedral angles and helix-helix contacts can be assigned to each residue in a membrane protein. Independent s...