In this paper, a novel thermal-aware dynamic placement planner for reconfigurable systems is presented, which targets transient temperature reduction. Rather than solving time-...
Shahin Golshan, Eli Bozorgzadeh, Benjamin Carri&oa...
- This paper addresses the problem of maximizing capacity utilization of the battery power source in a portable electronic system under latency and loss rate constraints. First, a ...
We address the problem of power estimation at the register-transfer level (RTL). At this level, the circuit is described in terms of a set of interconnected memory elements and co...
Power integrity simulation for system-on-package (SoP) based modules is a crucial bottleneck in the SoP design flow. In this paper, the multi-layer finite difference method (M-FDM...
Krishna Bharath, Ege Engin, Madhavan Swaminathan, ...
In response to the increasing variations in integrated-circuit manufacturing, the current trend is to create designs that take these variations into account statistically. In this...