Flash is a widely used storage device that provides high density and low power, appealing properties for general purpose computing. Today, its usual application is in portable spe...
Recently, Network-on-Chip (NoC) architectures have gained popularity to address the interconnect delay problem for designing CMP / multi-core / SoC systems in deep sub-micron tech...
Dongkook Park, Soumya Eachempati, Reetuparna Das, ...
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
This paper proposes a pilot-aided joint channel estimation and synchronization scheme for burst-mode orthogonal frequency division multiplexing (OFDM) systems. The scheme eliminate...
Abstract—The Internet has witnessed a rapid growth in deployment of gossip-based protocol in many multicast applications. In a typical gossip-based protocol, each node independen...
Yun Tang, Nan Zhang, Yuanchun Shi, Shiqiang Yang, ...