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SLIP
2009
ACM
16 years 25 days ago
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
HICSS
2008
IEEE
139views Biometrics» more  HICSS 2008»
16 years 24 days ago
Understanding the Roles of Knowledge Sharing and Trust in Online Learning Communities
This paper builds upon action and design research aimed at enhancing scholarly community and conversation in a graduate school setting. In this paper we focus on knowledge sharing...
Brian Thoms, Nathan Garrett, Jesus Canelon Herrera...
FOCI
2007
IEEE
16 years 20 days ago
Almost All Learning Machines are Singular
— A learning machine is called singular if its Fisher information matrix is singular. Almost all learning machines used in information processing are singular, for example, layer...
Sumio Watanabe
GECCO
2007
Springer
195views Optimization» more  GECCO 2007»
16 years 15 days ago
MILCS: a mutual information learning classifier system
This paper introduces a new variety of learning classifier system (LCS), called MILCS, which utilizes mutual information as fitness feedback. Unlike most LCSs, MILCS is specifical...
Robert Elliott Smith, Max Kun Jiang
TELETRAFFIC
2007
Springer
16 years 13 days ago
A Phase-Type Based Markov Chain Model for IEEE 802.16e Sleep Mode and Its Performance Analysis
Abstract. To support battery powered mobile broadband wireless access devices efficiently, IEEE 802.16e defines a sleep mode operation for conserving the power of mobile terminals...
Zhisheng Niu, Yanfeng Zhu, Vilius Benetis