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» A Technique for Large Automated Mechanism Design Problems
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DAC
2007
ACM
16 years 7 months ago
Placement of 3D ICs with Thermal and Interlayer Via Considerations
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
Brent Goplen, Sachin S. Sapatnekar
DAC
2003
ACM
16 years 7 months ago
Coverage directed test generation for functional verification using bayesian networks
Functional verification is widely acknowledged as the bottleneck in the hardware design cycle. This paper addresses one of the main challenges of simulation based verification (or...
Shai Fine, Avi Ziv
DAC
2005
ACM
15 years 8 months ago
Unified high-level synthesis and module placement for defect-tolerant microfluidic biochips
Microfluidic biochips promise to revolutionize biosensing and clinical diagnostics. As more bioassays are executed concurrently on a biochip, system integration and design complex...
Fei Su, Krishnendu Chakrabarty
CHI
1996
ACM
15 years 10 months ago
NewsComm: A Hand-Held Interface for Interactive Access to Structured Audio
The NewsComm system delivers personalized news and other program material as audio to mobile users through a hand-held playback device. This paper focuses on the iterative design ...
Deb K. Roy, Chris Schmandt
DAGSTUHL
1990
15 years 7 months ago
Parallel Rule-Firing Production Systems
One of the principal advantages of parallelizing a rule-based system, or more generally, any A.I. system, is the ability to pursue alternate search paths concurrently. Conventiona...
Daniel Neimann