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DAC
2012
ACM
13 years 9 months ago
Exploiting die-to-die thermal coupling in 3D IC placement
In this paper, we propose two methods used in 3D IC placement that effectively exploit the die-to-die thermal coupling in the stack. First, TSVs are spread on each die to reduce t...
Krit Athikulwongse, Mohit Pathak, Sung Kyu Lim
ACL
2012
13 years 9 months ago
Unsupervised Morphology Rivals Supervised Morphology for Arabic MT
If unsupervised morphological analyzers could approach the effectiveness of supervised ones, they would be a very attractive choice for improving MT performance on low-resource in...
David Stallard, Jacob Devlin, Michael Kayser, Yoon...
ACL
2012
13 years 9 months ago
Social Event Radar: A Bilingual Context Mining and Sentiment Analysis Summarization System
Social Event Radar is a new social networking-based service platform, that aim to alert as well as monitor any merchandise flaws, food-safety related issues, unexpected eruption o...
Wen-Tai Hsieh, Chen Ming Wu, Tsun Ku, Seng-cho Tim...
ACL
2012
13 years 9 months ago
Discriminative Pronunciation Modeling: A Large-Margin, Feature-Rich Approach
We address the problem of learning the mapping between words and their possible pronunciations in terms of sub-word units. Most previous approaches have involved generative modeli...
Hao Tang, Joseph Keshet, Karen Livescu
ICCAD
2003
IEEE
141views Hardware» more  ICCAD 2003»
15 years 12 months ago
An Enhanced Multilevel Algorithm for Circuit Placement
This paper presents several important enhancements to the recently published multilevel placement package mPL [12]. The improvements include (i) unconstrained quadratic relaxation...
Tony F. Chan, Jason Cong, Tim Kong, Joseph R. Shin...