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ICCAD
2007
IEEE
140views Hardware» more  ICCAD 2007»
16 years 3 months ago
Thermal-aware Steiner routing for 3D stacked ICs
— In this paper, we present the first work on the Steiner routing for 3D stacked ICs. In the 3D Steiner routing problem, the pins are located in multiple device layers, which ma...
Mohit Pathak, Sung Kyu Lim
ICCAD
2007
IEEE
134views Hardware» more  ICCAD 2007»
16 years 3 months ago
Hybrid CEGAR: combining variable hiding and predicate abstraction
ion Chao Wang NEC Laboratories America Hyondeuk Kim University of Colorado Aarti Gupta NEC Laboratories America Variable hiding and predicate abstraction are two popular abstracti...
Chao Wang, Hyondeuk Kim, Aarti Gupta
ICCAD
2006
IEEE
134views Hardware» more  ICCAD 2006»
16 years 3 months ago
A delay fault model for at-speed fault simulation and test generation
We describe a transition fault model, which is easy to simulate under test sequences that are applied at-speed, and provides a target for the generation of at-speed test sequences...
Irith Pomeranz, Sudhakar M. Reddy
ICCAD
2006
IEEE
169views Hardware» more  ICCAD 2006»
16 years 3 months ago
Microarchitecture parameter selection to optimize system performance under process variation
Abstract— Design variability due to within-die and die-todie process variations has the potential to significantly reduce the maximum operating frequency and the effective yield...
Xiaoyao Liang, David Brooks
ICCAD
2003
IEEE
158views Hardware» more  ICCAD 2003»
16 years 3 months ago
Approaching the Maximum Energy Saving on Embedded Systems with Multiple Voltages
Dynamic voltage scaling (DVS) is arguably the most effective energy reduction technique. The multiple-voltage DVS systems, which can operate only at pre-determined discrete voltag...
Shaoxiong Hua, Gang Qu
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