A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, high-speed interface to increase the device density and ...
Xiuyi Zhou, Yi Xu, Yu Du, Youtao Zhang, Jun Yang 0...
Battery lifetime, a primary design constraint for mobile embedded systems, has been shown to depend heavily on the load current profile. This paper explores how scheduling guidel...
V. Rao, N. Navet, G. Singhal, A. Kumar, G. S. Visw...
Clusters of SMPs are becoming increasingly common. However, the shared memory design of SMPs and the consequential contention between system processors for access to main memory c...
In this paper, we investigate the worst case performance of Earliest Due Date algorithm when applied to packet scheduling in distributed systems. We assume that the processing ele...