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187
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ICCD
2007
IEEE
16 years 3 months ago
2007
IEEE
Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
187
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DATE
2009
IEEE
16 years 1 months ago
2009
IEEE
Abstract—Multiple-voltage is an effective dynamic power reduction design technique. Recent research has shown that testing for resistive bridging faults in such designs requires ...
193
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GLVLSI
2009
IEEE
16 years 1 months ago
2009
IEEE
Recently, cooperative communication has attracted a lot of attention for its potential to increase spatial diversity. However, limited attention has been paid to the physical laye...
213
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IPPS
2009
IEEE
16 years 1 months ago
2009
IEEE
The increasing demand for computational cycles is being met by the use of multi-core processors. Having large number of cores per node necessitates multi-core aware designs to ext...
173
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IROS
2009
IEEE
16 years 1 months ago
2009
IEEE
— This paper discusses the mechanical kinematics solutions and design aspects of the biped robot SHERPA, a bipedal platform able to walk and carry load. Starting from the analysi...