This paper studies TSV-to-TSV coupling in 3D ICs. A full-chip SI analysis flow is proposed based on the proposed coupling model. Analysis results show that TSVs cause significan...
Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, ...
Abstract. Fair queueing in the wireless domain poses significant challenges due to unique issues in the wireless channel such as locationdependent and bursty channel errors. In thi...
Transforming models is a critical activity in Model Driven Engineering (MDE). With the expected adoption of the OMG QVT standard for model transformation language it is anticipate...
Abstract: We propose an optical broadcast-and-select network architecture with centralized multi-carrier light source (C-MCLS). It enables all network nodes access a large number o...
Research to date has demonstrated the apparent differences how architects, as ‘experts’ and members of the public as ‘non-experts’ perceive and understand visual represent...