1747 search results - page 311 / 350 » A Comparative Analysis of Architecture Frameworks |
308
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DAC
2011
ACM
14 years 6 months ago
2011
ACM
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
217
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DAC
2006
ACM
16 years 7 months ago
2006
ACM
Modern integrated circuits (ICs) are becoming increasingly complex. The complexity makes it difficult to design, manufacture and integrate these high-performance ICs. The advent o...
206
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MOBIHOC
2007
ACM
16 years 5 months ago
2007
ACM
We provide a general framework for the analysis of the capacity scaling properties in mobile ad-hoc networks with heterogeneous nodes and spatial inhomogeneities. Existing analyti...
188
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MOBIHOC
2006
ACM
16 years 5 months ago
2006
ACM
This paper addresses the problem of optimizing the packet transmission schedule in an ad hoc network with end-toend delay constraints. The emphasis is to determine the proper rela...
178
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KDD
2009
ACM
16 years 28 days ago
2009
ACM
Merchants selling products on the Web often ask their customers to share their opinions and hands-on experiences on products they have purchased. Unfortunately, reading through al...