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ASPDAC
2005
ACM
134views Hardware» more  ASPDAC 2005»
16 years 11 days ago
Wire congestion and thermal aware 3D global placement
— The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wirelength. However, wire congestion and thermal issues are exacerbated d...
Karthik Balakrishnan, Vidit Nanda, Siddharth Easwa...
ISLPED
2005
ACM
111views Hardware» more  ISLPED 2005»
16 years 11 days ago
Peak temperature control and leakage reduction during binding in high level synthesis
Temperature is becoming a first rate design criterion in ASICs due to its negative impact on leakage power, reliability, performance, and packaging cost. Incorporating awareness o...
Rajarshi Mukherjee, Seda Ogrenci Memik, Gokhan Mem...
ISLPED
2005
ACM
99views Hardware» more  ISLPED 2005»
16 years 11 days ago
Self-timed circuits for energy harvesting AC power supplies
The recent explosion in capability of embedded and portable electronics has not been matched by battery technology. The slow growth of battery energy density has limited device li...
Jeff Siebert, Jamie Collier, Rajeevan Amirtharajah
MINENET
2005
ACM
16 years 11 days ago
A first step toward understanding inter-domain routing dynamics
BGP updates are triggered by a variety of events such as link failures, resets, routers crashing, configuration changes, and so on. Making sense of these updates and identifying ...
Kuai Xu, Jaideep Chandrashekar, Zhi-Li Zhang
SASN
2005
ACM
16 years 11 days ago
Coordinated sensor deployment for improving secure communications and sensing coverage
Sensor network has a great potential in applications such as habitat monitoring, wildlife tracking, building surveillance, and military combat. The design of a sensor network syst...
Yinian Mao, Min Wu
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